Hepco - 9000 Series Model Solder Sphere Placement System 9000-1 115V 2AMPS

Description

Hepco - 9000 Series Model Solder Sphere Placement System 9000-1 115V 2AMPS
The Model 9000 operates using a self-contained vacuum system to secure the BGA            component while transferring the desired pattern of solder sphere's in a full array.
Alignment is achieved through precision pins and specific tooling for ease of use,              repeatability, and accuracy in sphere placement.
"Black Contrast" for easy visual inspection or arrays.
Repeatable process control to insure co-planarity and uniformity. MODEL 9000-1
Fits virtually all BGA layouts and sphere sizes.
Self-contained system, no additional air/vacuum required.
Ideal for Lower Volume Manufacturers, Rework, and Prototyping.
Process:
Place component in alignment plate.
Turn vacuum on.
Remove residual solder and/or contaminates.
Print flux on the component using appropriate stencil.
Load wand with sphere's using vacuum pick-up.
Align Wand using tooling pins.
Depress foot pedal to release the full array of sphere's.
Lift block.
Remove component from carrier.
Reflow the part using proper profile.
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